Multilayer
| Multilayer
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| We are building an enviable reputation for reliable Fast Turnaround Lead Times, which is of extreme importance to our overseas customers. |
| Our Multilayer Printed Circuit Boards are manufactured to the exacting Standards laid down by the relevant Authorities, whether the boards are for a Specific Release or for General Release. Our Motto is 'Never stray too far from Perfection!'. |
| For our BS, UL and CECC Standards Capabilities please check out our approvals pages. |
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Our, Komtek - Vacuum Lamination Press A Vacuum around the press daylights stabilises the environment during the entire press cycle. This reduces errors that can occur during this critical part of the multilayer manufacturing process. |
| Manufacture: | |
| General Capabilities: | |
| Maximum Layers: | 12 |
| with or without: - | Buried Via Holes |
| Blind via Holes | |
| Ball Grid Array | |
| Maximum Circuit Size: | 457 x 406mm [18" x 16"] larger upon request |
| Max Panelisation Size: | 508 x 457mm [20" x 18"] |
| Track / Gap: | 0.15mm [0.006"] |
| Minimum
Finished Hole Size: |
0.30mm [0.012"] |
| Common Finishes: | |
| Tin Lead: | Hot Air Solder Level |
| Solder Mask: | Two Part Epoxy (Heat Cured) |
| Single Part Epoxy (UV Cured) | |
| Liquid Photopolymer (Photoimageable) | |
| Legend (Notation, Ident) |
Two Part Epoxy (Heat
Cured) |
| Additional Finishes: | |
| Carbon Pack | |
| Peelable Resist | |
| Panel Scoring |
| Gold Plating: | |
 |
Nickel and Gold edge connectors |
| Selective pattern plated gold | |
| Electroless Nickel and Immersion Gold |
| Panelisation: | |
| Scoring | |
| Routing | |
| Naturally we are able any consider extra requirements you may have! | |